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STM32F401 データシート(PDF) 118 Page - STMicroelectronics |
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STM32F401 データシート(HTML) 118 Page - STMicroelectronics |
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118 / 135 page  Package characteristics STM32F401xD STM32F401xE 118/135 DocID025644 Rev 3 Device marking Figure 48. Example of WLCSP49 marking (top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. Table 80. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed |
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