Schematic diagram and pad configuration

JTS3702

4/10

DocID025632 Rev 1

Wafer dimension: 6 inches

Die size without scribe line:

•

X = 1306.0 µm

•

Y = 1076.0 µm

Scribe line: 60 µm

Bond pad opening 109 x 109 µm

Table 1. Pad coordinates (pad placement origin is the lower left corner of the die)

Pad number

Pad description

Center pad coordinates

X (µm)

Y (µm)

1

Output 1

140

1065.3

2

Inverting input 1

140

565.3

3

Non-inverting input 1

140

165.3

4

Vcc-

665

165.3

5

Non-inverting input 2

1190

165.3

6

Inverting input 2

1190

565.3

7

Output 2

1190

1065.3

8

Vcc+

665

1065.3