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SWCS049 データシート(PDF) 12 Page - Texas Instruments |
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SWCS049 データシート(HTML) 12 Page - Texas Instruments |
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12 / 119 page  12 TPS659110, TPS659112, TPS659113 TPS659114, TPS659118, TPS6591133 SWCS049Q – JUNE 2010 – REVISED MARCH 2016 www.ti.com Submit Documentation Feedback Product Folder Links: TPS659110 TPS659112 TPS659113 TPS659114 TPS659118 TPS6591133 Specifications Copyright © 2010–2016, Texas Instruments Incorporated (1) VCC7 should be connected to highest supply that is connected to device VCCx pin. Exception: VCC4, VCC5, and V5IN inputs can be higher than VCC7. VCCS can be higher than VCC7 if VMBBUF_BYPASS = 0 (buffer is enabled). 5.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN NOM MAX UNIT Input voltage range on pins or balls VCC1, VCC2, VCCIO, VCC5, VCC7, VCCS, VCC4, VBACKUP 2.7 3.8 5.5 V VCC3 1.7 3.8 5.5 VDDIO 1.65 1.8/3.3 3.45 VCC6 1.4 3.3 3.6 V5IN 4.5 6.5 VBST –0.1 3.45 SW (<30% of repetitive period) –1 28 TRIP, VFB –0.1 6.5 PWRON 0 3.8 5.5 SDA_SDI, SCL_SCK, EN2, EN1, SLEEP, INT1, CLK32KOUT 1.65 VDDIO 3.45 PWRHOLD, HDRST 1.65 VRTC 5.5 Input voltage range on balls GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, PWRDN 1.65 VRTC 5.5 V VCCS 0 5.5 Ambient temperature –40 27 85 °C Junction temperature, TJ –40 27 125 Lead temperature (soldering, 10 s) 260 (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics, SPRA953. (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. 5.4 Thermal Information THERMAL METRIC(1) ZRC (BGA) UNIT(2) 98 PINS RθJA Junction-to-ambient thermal resistance 32 °C/W RθJC(top) Junction-to-case (top) thermal resistance 18 °C/W RθJB Junction-to-board thermal resistance 16 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 12 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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