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M02015 データシート(PDF) 2 Page - M/A-COM Technology Solutions, Inc.

部品番号 M02015
部品情報  Low Power CMOS Transimpedance Amplifier with Rx Pwr Mon Output and AGC for Fiber
PDF  29 Pages
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メーカー  MA-COM [M/A-COM Technology Solutions, Inc.]
ホームページ  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

M02015 データシート(HTML) 2 Page - M/A-COM Technology Solutions, Inc.

  M02015 Datasheet HTML 1Page - M/A-COM Technology Solutions, Inc. M02015 Datasheet HTML 2Page - M/A-COM Technology Solutions, Inc. M02015 Datasheet HTML 3Page - M/A-COM Technology Solutions, Inc. M02015 Datasheet HTML 4Page - M/A-COM Technology Solutions, Inc. M02015 Datasheet HTML 5Page - M/A-COM Technology Solutions, Inc. M02015 Datasheet HTML 6Page - M/A-COM Technology Solutions, Inc. M02015 Datasheet HTML 7Page - M/A-COM Technology Solutions, Inc. M02015 Datasheet HTML 8Page - M/A-COM Technology Solutions, Inc. M02015 Datasheet HTML 9Page - M/A-COM Technology Solutions, Inc. Next Button
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M02015
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
http://www.macom.com/support
2
Low Power CMOS Transimpedance Amplifier with Rx Pwr Mon Output and AGC for Fiber
Optic Networks up to 2.5 Gbps
Rev V6
Ordering Information
Part Number
Package
Operating Temperature
M02015-XX
Waffle Pack
–40 °C to 95 °C
M02015-XX
Expanded whole wafer on a ring
–40 °C to 95 °C
Revision History
Revision
Level
Date
Description
V6
Release
May 2015
Updated logos and page layout. No content changes.
H (V5)
Release
February 2014
Update Imon_off specification in Table 1-4
G (V4)
Release
August 2007
Corrected PinA, AGC, and DOUT absolute maximum voltage in Table 1-1. Corrected
Section 4.4.
F (V3)
Release
December 2006
Corrected bottom picture in Figure 4-1.
E (V2)
Release
October 2006
Updated the +/- signs on the x axis in the Die Specification (Chapter 5) and added
notes to clarify the bonding requirements.



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