MICROWAVE CORPORATION

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

2

Outline Drawing

1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).

2. TYPICAL BOND PAD IS .004” SQUARE.

3. TYPICAL BOND PAD SPACING IS .006” CENTER TO CENTER EXCEPT AS NOTED.

4. BACKSIDE METALIZATION: GOLD

5. BACKSIDE METAL IS GROUND

6. BOND PAD METALIZATION: GOLD

HMC424

0.5dB LSB GaAs MMIC 6-BIT DIGITAL

ATTENUATOR, DC - 13 GHz

v02.0404

Pad Number

Function

Description

Interface Schematic

GND

Die bottom must be connected to RF ground.

1, 3

RF1, RF2

This pad is DC coupled and matched to 50 Ohm. Blocking capaci-

tors are required if RF line potential is not equal to 0V.

2

VEE

Supply Voltage -5V

4, 5, 6, 7, 8, 9

V1 - V6

See truth table and control voltage table.

Pad Descriptions