データシートサーチシステム
  Japanese  ▼
ALLDATASHEET.JP

X  

HMC438MS8G データシート(PDF) 3 Page - Hittite Microwave Corporation

部品番号 HMC438MS8G
部品情報  SMT GaAs HBT MMIC DIVIDE-BY-5, DC - 7.0 GHz
PDF  6 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
メーカー  HITTITE [Hittite Microwave Corporation]
ホームページ  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

HMC438MS8G データシート(HTML) 3 Page - Hittite Microwave Corporation

  HMC438MS8G Datasheet HTML 1Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 2Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 3Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 4Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 5Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 6Page - Hittite Microwave Corporation  
Zoom Inzoom in Zoom Outzoom out
 3 / 6 page
background image
MICROWAVE CORPORATION
10 - 98
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
10
-300
-200
-100
0
100
200
300
400
22.5
23
23.5
24
24.5
25
25.5
TIME (ns)
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
Absolute Maximum Ratings
Outline Drawing
Typical Supply Current vs. Vcc
Note: Divider will operate over full voltage range shown above
RF Input (Vcc= +5V)
+13 dBm
Vcc
+5.5V
Maximum Channel Temperature
135 °C
Continuous Pdiss (T=85 °C)
(derate 11.3mW/°C above 92 °C)
485mW
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Vcc (V)
Icc (mA)
4.75
75
5.0
80
5.25
87
DC blocking capacitors are required at RF input and RF output ports.
Choose value for lowest frequency of operation.
HMC438MS8G
SMT GaAs HBT MMIC
DIVIDE-BY-5, DC - 7.0 GHz
v01.1002
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.



Html Pages

1 2 3 4 5 6


データシート ダウンロード

Go To PDF Page


リンク URL



ALLDATASHEETはお客様のビジネスに役立ちますか?  [ DONATE ] 

Alldatasheetは   |   広告   |   お問い合わせ   |   プライバシーポリシー   |   データシートへのリンク    |   リンク交換   |   メーカーリスト
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com