データシートサーチシステム
  Japanese  ▼
ALLDATASHEET.JP

X  

ADL6010SCPZN-R7 データシート(PDF) 8 Page - Analog Devices

部品番号 ADL6010SCPZN-R7
部品情報  Fast Responding, 45 dB Range, 0.5 GHz to 43.5 GHz Envelope Detector
PDF  22 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
メーカー  AD [Analog Devices]
ホームページ  http://www.analog.com
Logo AD - Analog Devices

ADL6010SCPZN-R7 データシート(HTML) 8 Page - Analog Devices

Back Button ADL6010SCPZN-R7 Datasheet HTML 4Page - Analog Devices ADL6010SCPZN-R7 Datasheet HTML 5Page - Analog Devices ADL6010SCPZN-R7 Datasheet HTML 6Page - Analog Devices ADL6010SCPZN-R7 Datasheet HTML 7Page - Analog Devices ADL6010SCPZN-R7 Datasheet HTML 8Page - Analog Devices ADL6010SCPZN-R7 Datasheet HTML 9Page - Analog Devices ADL6010SCPZN-R7 Datasheet HTML 10Page - Analog Devices ADL6010SCPZN-R7 Datasheet HTML 11Page - Analog Devices ADL6010SCPZN-R7 Datasheet HTML 12Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 8 / 22 page
background image
ADL6010
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
COMM
Device Ground. Connect COMM to the system ground using a low impedance ground plane together with the
exposed pad (EPAD).
2
VOUT
Output Voltage. The output from the VOUT pin is proportional to the envelope value at the RFIN pin.
3
VPOS
Supply Voltage. The operational range is from 4.75 V to 5.25 V. Decouple the power supply using the suggested
capacitor values of 100 pF and 0.1 µF and locate these capacitors as close as possible to the VPOS pin.
4, 6
RFCM
Device Grounds. Connect the RFCM pins to the system ground using a low impedance ground plane together
with the exposed pad (EPAD).
5
RFIN
Signal Input. The RFIN pin is ac-coupled and has an RF input impedance of approximately 50 Ω.
EPAD
Exposed Pad. The exposed pad (EPAD) on the underside of the device is also internally connected to ground and
requires good thermal and electrical connection to the ground of the printed circuit board (PCB). Connect all
ground pins to a low impedance ground plane together with the EPAD.
NOTES
1. EXPOSED PAD. THE EXPOSED PAD (EPAD) ON THE UNDERSIDE OF THE DEVICE
IS ALSO INTERNALLY CONNECTED TO GROUND AND REQUIRES GOOD THERMAL
AND ELECTRICAL CONNECTION TO THE GROUND OF THE PRINTED CIRCUIT BOARD (PCB).
CONNECT ALL GROUND PINS TO A LOW IMPEDANCE GROUND PLANE
TOGETHER WITH THE EPAD.
6
COMM
4
VPOS
5
VOUT
1
RFCM
3
RFCM
2
RFIN
ADL6010
TOP VIEW
(Not to Scale)
Rev. A | Page 8 of 22



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22


データシート ダウンロード

Go To PDF Page


リンク URL



ALLDATASHEETはお客様のビジネスに役立ちますか?  [ DONATE ] 

Alldatasheetは   |   広告   |   お問い合わせ   |   プライバシーポリシー   |   データシートへのリンク    |   リンク交換   |   メーカーリスト
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com