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IX2113 データシート(PDF) 13 Page - IXYS Corporation |
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IX2113 データシート(HTML) 13 Page - IXYS Corporation |
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13 / 13 page ![]() INTEGRATED CIRCUITS DIVISION IX2113 R03 www.ixysic.com 13 3.5.3 IX2113G: 14-Pin DIP Through-Hole Package NOTES: 1. JEDEC outline: MS-001 AA. 2. This dimension does not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.254 (0.010). 3. Measured at the lead tips with the leads unconstrained. 4. Pointed or rounded lead tips are preferred to ease insertion. 5. Distance between leads including dam bar protrusions to be 0.127 (0.005). 6. Datum plane H coincident with the bottom of lead where lead exits body. DIMENSIONS (min / max) mm (inches) Pin 1 8.509 / 9.525 (0.335 / 0.375) See Note 3 7.62 BSC (0.300 BSC) 18.542 / 19.050 (0.730 / 0.750) See Note 2 2.921 / 3.810 (0.115 / 0.150) 0.381 min (0.015 min) 0.457 typ (0.018 typ) 2.542 (0.100) 3.175 / 3.429 (0.125 / 0.135) 1.524 typ (0.06 typ) 6.223 / 6.477 (0.245 / 0.255) See Note 2 PCB Hole Pattern 7.62 (0.300) 2.54 (0.100) 1.35 (0.053) 0.85 (0.0335) Hole Size = 5.334 max (0.210 max) H Seating Plane 0º / 15º For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IX2113-R03 ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 6/9/2014 |
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