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20110518a

MIXA81H1200EH

IXYS reserves the right to change limits, test conditions and dimensions.

Module

Ratings

Symbol

Definitions

Conditions

min.

typ. max.

Unit

T

VJ

T

VJM

T

stg

operating temperature

max. virtual junction temperature

storage temperature

-40

-40

125

150

125

°C

°C

°C

V

ISOL

isolation voltage

I

3000

V~

CTI

comparative tracking index

200

M

d

mounting torque (M5)

3

6

Nm

d

S

d

A

creep distance on surface

strike distance through air

10

7.5

mm

mm

R

pin-chip

resistance pin to chip

2.5

mW

R

thCH

thermal resistance case to heatsink

with heatsink compound

0.02

K/W

Weight

300

g

Equivalent Circuits for Simulation

Ratings

Symbol

Definitions

Conditions

min.

typ. max.

Unit

V

0

R

0

IGBT

T1 - T6

T

1.1

17.9

V

m

W

V

0

R

0

free wheeling diode

D1 - D6

T

1.09

9.1

V

m

W

I

V

0

R

0

T