TFP403PZP datasheet(6/20 Pages) TI1

6 / 20 page

TFP403

PanelBus™ DIGITAL RECEIVER

SLDS125B − DECEMBER 2000 − REVISED MAY 2011

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

Supply voltage range, DVDD, AVDD, OVDD, PVDD

−0.3 V to 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, logic/analog signals

−0.3 V to 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating ambient temperature range

0°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range

-−65°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Case temperature for 10 seconds

260°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package power dissipation/PowerPAD: Soldered (see Note 1)

4.3 W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Not soldered (see Note 2)

2.7 W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD Protection, all pins

2.5 KV Human Body Model

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JEDEC latch up (EIA/JESD78)

100 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. Specified with PowerPAD bond pad on the backside of the package soldered to a 2 oz. Cu plate PCB thermal plane. Specified at

maximum allowed operating temperature, 70°C.

2. PowerPAD bond pad on the backside of the package is not soldered to a thermal plane. Specified at maximum allowed operating

temperature, 70°C.

recommended operating conditions

MIN

TYP

MAX

UNIT

Supply voltage, VDD (DVDD, AVDD, PVDD, OVDD)

3.3

3.6

Pixel time, tpix‡

6.06

Single ended analog input termination resistance, Rt

Operating free-air temperature, TA

°C

‡ tpix is the pixel time defined as the period of the RxC clock input. The period of the output clock, ODCK is equal to tpix when in 1-pixel/clock mode

and 2tpix when in 2-pixel/clock mode.

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