LP5526

SNVS431D – FEBRUARY 2006 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

V (SW, FB, MAIN, SUB, RLED, GLED, BLED)

-0.3V to +23V

-0.3V to +6.0V

Voltage on Logic Pins

10µA

I(RLED, GLED, BLED)

100mA

Internally Limited

125ºC

Storage Temperature Range

-65ºC to +150ºC

260ºC

ESD Rating

2kV

Machine Model

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

(4)

For detailed soldering specifications and information, please refer to Application Note AN1112 : Micro SMD Wafer Level Chip Scale

Package SNVA009

(5)

The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

Operating Ratings

(1) (2)

V (SW, FB, MAIN, SUB)

0 to +21V

3.0 to 5.5V

Recommended Load Current (RLED, GLED, BLED) CC Mode

0mA to 50mA/driver

Recommended Total Boost Converter Load Current

0mA to 150mA

-30ºC to +125ºC

(3)

-30ºC to +85ºC

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

Thermal Properties

Junction-to-Ambient Thermal Resistance (

(1)

60ºC/W to 100ºC/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

4

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