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SURFACE MOUNT

SURFACE MOUNT CHIP RESISTOR RPC

OTHER SPECIFICATIONS & TEST METHODS

PERFORMANCE TEST

TEST METHOD

1% TOL.

5% TOL.

Temperature coefficient

MIL-STD-202F, Method 304

-55˚C to +125˚C

by Type

by Type

Thermal Shock

MIL-STD-202F, Method 107

5 Cycles, -55˚C to +125˚C (Step by Step 2 min)

±(0.5%+0.05Ω)

±(1%+0.05Ω)

Low Temperature Operation

MIL-R-55342D, Para.4.7.4

One Hour at -65˚C Followed by 45 min RCWV

±(0.5%+0.05Ω)

±(1%+0.05Ω)

Short Time Overload

MIL-R-55342D, Para.4.7.5

2.5 Times RCWV for 5 Seconds

±(1%+0.05Ω)

±(2%+0.05Ω)

Insulation Resistance

MIL-STD-202F, Method 302

RCOV for 1 minute

10000MΩ

10000MΩ

Dielectric Withstand Voltage

MIL-STD-202F, Method 301

R.M.S for 1 minute

by Type

by Type

Resistance to Soldering Heat

MIL-STD-202F, Method 210C

Soldered to Test Board at 260˚C for 10 Seconds

±(0.5%+0.05Ω)

±(1%+0.05Ω)

Moisture Resistance

MIL-STD-202F, Method 160F

42 Cycles. Total 1000 Hours

±(0.5%+0.05Ω)

±(2%+0.05Ω)

Life

MIL-STD-202F, Method 108A

1000 Hours at 70˚C RCWV Intermittent

±(1%+0.05Ω)

±(3%+0.05Ω)

Resistance to Soldering Heat

MIL-STD-202F, Method 210C

260˚C, for 5 Seconds

95% min. coverage

95% min. coverage

Bending Strength

JIS-C-5202, Para.6.1.4, Unit Mounted in Centre of 90mm Board Length

±(1%+0.05Ω)

±(1%+0.05Ω)

Deflected 5mm (power chip 2mm) in Either Direction for 5 Seconds

For taping and packaging specification please see the RTF range.

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