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TDA3608THQ データシート(PDF) 19 Page - NXP Semiconductors |
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TDA3608THQ データシート(HTML) 19 Page - NXP Semiconductors |
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19 / 22 page  2003 Nov 28 19 Philips Semiconductors Product specification Multiple voltage regulators with switch TDA3608Q; TDA3608TH During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. |
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