MIC45116 datasheet(7/42 Pages) MICROCHIP

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 2016 Microchip Technology Inc.

DS20005571A-page 7

MIC45116

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+125

°C

Note 1

Maximum Junction Temperature

—

+150

°C

—

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

+260

°C

Soldering, 10s

Package Thermal Resistances

52-pin 8 mm x 8 mm x 3 mm QFN

JA

—22

—

°C/W

Note 2

52-pin 8 mm x 8 mm x 3 mm QFN

JC

—5

—

°C/W

Note 2

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

JA and JC were measured using the MIC45116 evaluation board.

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