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Part No. : LTE-R38386L-S

BNS-OD-FC 002/A4

IR Emitter and Detector

LTE-R38386L-S

8.4. Soldering

Recommended soldering conditions:

Reflow Soldering

Soldering iron

Pre-heat

Pre-heat time

Peak temperature

Soldering time

150~200°C

120 seconds Max.

260°C Max.

10 seconds Max.(Max. two times)

Temperature

Soldering time

300°C Max.

3 seconds Max.

(one time one)

Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no

single temperature profile works for all possible combinations.

However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific

characterization.

LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.

The results of this testing are verified through post-reflow reliability testing.

Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface

mounted.

Following figure shows a sample temperature profile compliant to JEDEC standards.

You can use this example as a generic target to set up your reflow process.

You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste

manufacturer to avoid damaging the device and create a reliable solder joint.