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STM32F427AI データシート(PDF) 218 Page - STMicroelectronics |
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STM32F427AI データシート(HTML) 218 Page - STMicroelectronics |
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218 / 239 page  DocID024030 Rev 9 217/238 STM32F427xx STM32F429xx Package information 231 Figure 96. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array recommended footprint Note: Non-solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. F 0.450 0.500 0.550 0.0177 0.0197 0.0217 ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 117. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 116. UFBGA169 - 169-ball 7 x 7 mm 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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