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STM32F427AI データシート(PDF) 238 Page - STMicroelectronics

部品番号 STM32F427AI
部品情報  ARM Cortex-M4 32b MCUFPU, 225DMIPS, up to 2MB Flash/2564KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT
PDF  239 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F427AI データシート(HTML) 238 Page - STMicroelectronics

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DocID024030 Rev 9
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STM32F427xx STM32F429xx
Revision history
237
21-Jan-2016
8
Updated Figure 22: Power supply scheme.
Added td(TXD) values corresponding to 1.71 V < VDD < 3.6 V in
Table 72: Dynamics characteristics: Ethernet MAC signals for RMII.
18-Jul-2016
9
Updated Figure 1: Compatible board design
STM32F10xx/STM32F2xx/STM32F4xx for LQFP100 package.
Added mission profile compliance with JEDEC JESD47 in
Section 6.2: Absolute maximum ratings.
Changed Figure 31 HSI deviation versus temperature to ACCHSI
versus temperature.
Updated RLOAD in Table 85: DAC characteristics.
Added note 2. related to the position of the 0.1 µF capacitor below
Figure 37: Recommended NRST pin protection.
Updated Figure 40: SPI timing diagram - master mode.
Added reference to optional marking or inset/upset marks in all
package device marking sections. Updated Figure 85: WLCSP143
marking example (package top view), Figure 88: LQFP144
marking example (package top view), Figure 91: LQFP176
marking (package top view), Figure 94: LQFP208 marking
example (package top view).
Updated Figure 98: UFBGA176+25 - ball 10 x 10 mm, 0.65 mm pitch
ultra thin fine pitch ball grid array package outline and Table 118:
UFBGA176+25 - ball, 10 x 10 mm, 0.65 mm pitch, ultra fine pitch ball
grid array package mechanical data.
Table 124. Document revision history
Date
Revision
Changes



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