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168

Surface

Heatsink

Area

Weight

Length “L”

Part Number

(oz/g)

(mm)

C247-025

11 / 7,312

0.5 / 15

25

C247-050

23 / 14,858

1.1 / 31

50

C247-075

34 / 21,655

1.6 / 45

75

C264-030

13 / 8,774

0.7 / 19

30

C264-058

25 / 16,963

1.35 / 37

58

C264-085

37 / 24,861

1.97 / 54

85

C220-025

11 / 7,312

0.5 / 15

25

C220-050

23 / 14,858

1.1 / 31

50

C220-075

34 / 21,655

1.6 / 45

75

C126-025

10.2 / 6,559 0.45 / 12.7

25

C126-040 16.3 / 10,495 0.72 / 20.3

40

C126-050 20.4 / 13,119 0.90 / 25.4

50

C126-075 30.6 / 21,655 1.35 / 38.1

75

Ohmite introduces the C series (Pat. Pending). This

series offers high performance, low cost and a

compact heat sink with an integrated camming clip

system for TO-126, TO-220, TO-247 and TO-264

devices. This powerful heat sink provides tool and

fixture free assembly operation, largest surface areas

and smallest space occupation. It is the ideal type of

heat sink for high power density and small size (1U

or 2U) electronic packaging with forced convection

cooling.

FEA TURES

•MinimumassemblycostandlaborSpringClips

make the mounting holes, fasteners, tools and

fixtures obsolete in assembly operations & reduce

costs.

•MaximumThermalTransferMaximumsurfacearea

per unit volume, efficient cooling fins & consistent

mounting force reduces thermal resistance.

•MaximumRepeatabilityConstantspringforceover

repeated assembly/disassembly.

•MaximumReliabilityResilientspringactionlocks

electronic component in place. Fewer parts in

assembly and no fasteners and washers required.

Prevent short circuit by eliminating metal particles

generated from hardware or thread tapping.

•DesignFlexibilityMaximumflexibilityfordynamic

device locations and power upgrading. “Configure-

to-Fit” gives designers total freedom to configure

heat sink needed to fit into a multitude design envi-

ronments.

C Series

TO-126, TO-247, TO-220

and TO-264 Package Heatsinks

C h ARACTER i ST i CS

Heat Sink

Aluminum Alloy 6063-T5 or Equivalent

with either degreased or black anod-

ized finish.

Spring Clip

Music Wire, Per ASTM A228 with

bright nickel plating

Solder Foot

Cold-rolled Steel, Per ASTM A-366

with pure tin over copper strike. RoHS

compliant.

Interface

Thermal

Resistance

for improvement, use thermal joint

compound, 0.005 Grafoil (TGon 800

by Laird), or phase change material

(Hi-Flow by Bergquist)

Insulato

r (Optional) Sil-Pad 900-S, K6 800-S

and K10 by Bergquist

SER i ES SPEC i F i CAT i ONS

hEAT Di SS i P AT i ON

Heat Dissipated, total for ALL devices (watts)

120

80

0

510

100

15

0

140

2

1

0

3

8

7

9

600

200

400

1000

60

40

20

5

6

4

Air Velocity (ft./min.)

800

C247-025-1AE (1 device)

C247-050-2AE (2 devices)

C247-075-3AE (3 devices)

HeatdissipationisthetotalforALLDEVICESattachedtoheatsink.

Total Heat Dissipated (watts)

36

32

22

6

7

8

9

10

34

2

3

4

5

38

12

10

600

200

400

1000

30

28

24

26

6

8

4

Air Velocity (ft./min.)

800

TO-126/CE-S102 (25mm long)

one device w/Sil-pad 900s

(continued)