Data Sheet

AD8392A

Rev. A | Page 11 of 12

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-153-AET

28

15

14

1

EXPOSED

PAD

(Pins Up)

9.80

9.70

9.60

4.50

4.40

4.30

6.40

BSC

TOP VIEW

BOTTOM VIEW

0.65 BSC

0.15

0.05

COPLANARITY

0.10

1.20 MAX

1.05

1.00

0.80

0.30

0.19

SEATING

PLANE

0.20

0.09

3.05

3.00

2.95

8°

0°

0.75

0.60

0.45

3.55

3.50

3.45

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 21. 28-Lead Thin Shrink Small Outline with Exposed Pad [TSSOP_EP]

(RE-28-1)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 22. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

AD8392AAREZ

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP_EP)

RE-28-1

AD8392AAREZ-RL

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP_EP)

RE-28-1

AD8392AAREZ-R7

−40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP_EP)

RE-28-1

AD8392AACPZ-R2

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-7

AD8392AACPZ-RL

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-7

AD8392AACPZ-R7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-7

1

Z = RoHS Compliant Part.