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SNN60-RXP データシート(PDF) 1 Page - Laird Tech Smart Technology

部品番号 SNN60-RXP
部品情報  SNN60-RXP Form-In-Place
PDF  2 Pages
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メーカー  LSTD [Laird Tech Smart Technology]
ホームページ  http://www.lairdtech.com/
Logo LSTD - Laird Tech Smart Technology

SNN60-RXP データシート(HTML) 1 Page - Laird Tech Smart Technology

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Innovative Technology
for a Connected World
SNN60-RXP
Form-In-Place
TYPICAL VALUES
SNN60-RXP Form-In-Place
A rapid cure, silver/nickel-filled silicone elastomer Form-In-Place gasket material.
Laird Technologies introduces another product in the EMI Sentry family. These Form-In-Place pastes are
extremely fast curing with reliable shielding effectiveness and strength.
Laird Technologies’ Form-In-Place is an automated system for dispensing conductive elastomer EMI shielding
and grounding gaskets onto metal or plastic substrates. This product is particularly ideal for base stations,
PDAs, PC cards, radios, mobile phones, as well as many other cast or plastic enclosures and packaged
electronic assemblies.
(a)
Compression-deflectionbeadsize0.62mm(H)x0.70mm(W)
global solutions: local support
TM
Americas: +1 866.928.8181
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com
TEST METHOD
UNITS
SNN60-RXP
Elastomer
Silicone
Filler
Silver/Nickel
Color
Tan
ELECTRICAL PROPERTIES
Volume Resistivity
ohm-cm
0.005
Shielding Effectiveness
MIL-DTL-83528C
200MHzto10GHz
Para.4.5.12
dB
>100
PHYSICAL PROPERTIES
Hardness
ASTMD2240
Shore A
60
Tensile Strength
ASTMD412
psi
192
Tensile Elongation
ASTMD412
%
110
Density (cured)
ASTMD792
g/cm3
3.9
Density (uncured)
LT-FIP-CLE-09
g/cm3
3.1
Compression Set
ASTMD395
%
15
Adhesion Strength (Al)
LT-FIP-CLE-03
N/cm2
180
Compression-Deflection(a)
LT-FIP-CLE-07
at20%compression
lb/in
1.7
at40%compression
lb/in
6.4
Temperature Range
°C
-50°Cto125°C
UL rating
UL-94
V0
CURING REQUIREMENTS
Cure Conditions
15°Cto40°C,50%relativehumidity
At22°Cand50%RH
LT-FIP-CLE-14
Time before handling
1hour
Full Cure
24hours
rev.03/17/10
* does not represent
actual color


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