Innovative Technology

for a Connected World

Thermally Conductive PCB Substrate

THR-DS-Tlam-SS-HTD 0711

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OPERATINGVOLTAGE

UNITS

TLam SS HTD04

TLam SS HTD06

Continuous AC, Max

VAC

240

480

Continuous DC, Max

VDC

450

950

Peak Recurring, Max

Vp

600

1200

THERMALPROPERTIES

UNITS

TLam SS HTD04

TLam SS HTD06

Thermal Conductivity

watt/m ºK

2.2

2.2

Thermal Resistance

ºC-in²/watt

(ºC-cm²/watt)

0.072

(0.464)

0.107

(0.690)

GlassTransitionTemperature

ºC

168

168

Soldering Temperature, Maximum

ºC

288

288

Heat Capacity

J/gºC

1.12

1.12

ELECTRICALPROPERTIES

UNITS

TLam SS HTD04

TLam SS HTD06

Dielectric Constant @ 1KHz/1MHz

5.1/4.9

4.9/4.7

Dissipation Factor @ 1KHz

0.007

0.007

Capacitance @ 1KHz

pF/in² (pF/cm²)

287 (45)

191 (31)

VolumeResistivity@25ºC

ohm-cm

1.4E+15

1.4E+15

VolumeResistivity@150ºC

ohm-cm

2.0E+11

2.0E+11

Surface Resistivity

ohm

1.5E+12

1.5E+12

Dielectric Strength

VAC/mil(kVAC/mm)

1000 (39.3)

1000 (39.3)

WithstandVoltage(DC)

VDC

>4000

>6000

MECHANICALPROPERTIES

UNITS

TLam SS HTD04

TLam SS HTD06

Dielectric Thickness

inch (mm)

0.004 (0.102)

0.006 (0.152)

Peel Strength

lbs/in (Kg/cm)

6.5 (1.16)

7.0 (1.25)

CTE<TgXY/Zaxis

ppm/ºC

16/36

16/36

CTE>TgXY/Zaxis

ppm/ºC

18/155

18/155

Young'sModulus@25/150ºC

MPa

13180/6810

13180/6810

Poisson'sRatio25/150ºC

0.277/0.263

0.277/0.263

Flexural Strength 25 ºC

MPa

142

142

AGENCYRATINGS&DURABILITY

UNITS

TLam SS HTD04

TLam SS HTD06

ULContinuousOperatingTemp

ºC

150

150

ULFlammability

E165095

94V0

94V0

Comparative Tracking Index

600

600

Solder Float (4 min. @ 288 ºC)

Pass

Pass

Allpropertiesaretypical@25°C,unlessotherwisespecified.

For design engineer guidance only, observed performance varies in application.

Engineersareremindedtotestthematerialinapplication.

Peel strength is measured with 1oz Cu weight.

All properties are based on nominal thickness.

ThelayoutandprocessmayrequirethickerstartingTpregtomeetnominallaminatedthickness.