TMP93CS40DF datasheet(21/48 Pages) TOSHIBA

部品番号	TMP93CS40DF

部品情報	Quality And Reliability Assurance / Handling Precautions

PDF	48 Pages

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メーカー	TOSHIBA [Toshiba Semiconductor]

ホームページ	http://www.semicon.toshiba.co.jp/eng

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21 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-21

2002-02-20

Table 2.8

Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (3/3)

Products

Name

Package no.

Air reflow

Infrared reflow

TMP47C660AF

P-QFP64-1420-1.00A

A(168h)

TMP47C860AF

P-QFP64-1420-1.00A

A(168h)

TMP47P860VF

P-QFP64-1420-1.00A

TMP47C1220F

P-QFP80-1420-0.80B

A(168h)

TMP47C1620F

P-QFP80-1420-0.80B

A(168h)

TMP47P1620VF

P-QFP80-1420-0.80B

B(72h)

TMP47C1260F

P-QFP64-1420-1.00A

A(168h)

TMP47C1660F

P-QFP64-1420-1.00A

A(168h)

TMP47P1660VF

P-QFP64-1420-1.00A

B(72h)

Note 1:

As of March, 2001

Note 2:

Symbols A (168h), B (72h), C (48h), D (24h), E(12h),

G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device.

For

details of these conditions, please refer to Table 2.2.

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