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TMP93CS32F データシート(PDF) 16 Page - Toshiba Semiconductor

部品番号 TMP93CS32F
部品情報  Quality And Reliability Assurance / Handling Precautions
PDF  48 Pages
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メーカー  TOSHIBA [Toshiba Semiconductor]
ホームページ  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TMP93CS32F データシート(HTML) 16 Page - Toshiba Semiconductor

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Quality and Reliability Assurance / Handling Precautions
030901
QUA-16
2002-02-20
Table 2.5
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (3/3)
Products
Name
Air reflow
Infrared reflow
TMP87CH48DF
A(168h)
A(168h)
TMP87PH48U
A(168h)
A(168h)
TMP87PH48DF
A(168h)
A(168h)
TMP87CM53F
A(168h)
A(168h)
TMP87PM53F
A(168h)
A(168h)
TMP87CM64F
A(168h)
A(168h)
TMP87CP64F
A(168h)
A(168h)
TMP87CS64F
A(168h)
A(168h)
TMP87PS64F
A(168h)
A(168h)
TMP87CS68DF
GG
TMP87PS68DF
A(168h)
A(168h)
TMP87CC70F
A(168h)
A(168h)
TMP87CH70F
A(168h)
A(168h)
TMP87CK70AF
A(168h)
A(168h)
TMP87CM70AF
A(168h)
A(168h)
TMP87CH70BF
A(168h)
A(168h)
TMP87CM70BF
A(168h)
A(168h)
TMP87PM70F
B(72h)
B(72h)
TMP87CM71F
A(168h)
A(168h)
TMP87CN71F
A(168h)
A(168h)
TMP87CP71F
A(168h)
A(168h)
TMP87CS71F
A(168h)
A(168h)
TMP87PS71F
B(72h)
B(72h)
TMP87CH74AF
A(168h)
A(168h)
TMP87CM74AF
A(168h)
A(168h)
TMP87PM74F
B(72h)
B(72h)
TMP87CH75F
A(168h)
A(168h)
TMP87CM75F
A(168h)
A(168h)
TMP87PM75F
A(168h)
A(168h)
TMP87CC78F
A(168h)
A(168h)
TMP87CH78F
A(168h)
A(168h)
TMP87CK78F
A(168h)
A(168h)
TMP87CM78F
A(168h)
A(168h)
TMP87PM78F
A(168h)
A(168h)
Note 1:
As of March, 2001
Note 2:
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G and indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device.
For
details of these conditions, please refer to Table 2.2.



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