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ST1S31 データシート(PDF) 21 Page - STMicroelectronics |
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ST1S31 データシート(HTML) 21 Page - STMicroelectronics |
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21 / 35 page ![]() DocID022998 Rev 4 21/35 ST1S31 Application information 35 The feedback pin (FB) connection to the external resistor divider is a high impedance node, so the interference can be minimized by routing the feedback node with a very short trace and as far as possible from the high current paths. A single point connection from signal ground to power ground is suggested. Thanks to the exposed pad of the device, the ground plane helps to reduce the thermal resistance junction to ambient; so a large ground plane, soldered to the exposed pad, enhances the thermal performance of the converter allowing high power conversion. Figure 10. PCB layout example AM11423v1 Input cap as close as possible to VINSW pin Star center for common ground Short FB trace VINA derived from Cin To avoid dynamic voltage drop Between VINA and VINSW Short high switching current loop Via to connect the thermal pad To bottom or inner ground plane |
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