VITESSE

SEMICONDUCTOR CORPORATION

Preliminary Data Sheet

VSC7927

SONET/SDH 2.5Gb/s Laser Diode Driver

Page 8

G52201-0, Rev 3.0

04/05/01/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Figure 8: Pad Assignments for VSC7927 Die

PAD 25

PAD 24

PAD 23

PAD 22

PAD 21

PAD 20

PAD 19

PAD 18

VIB

GND

IOUT

IOUT

GND

GND

NIOUT

IBIAS

PAD 1

PAD 34 PAD 33 PAD 32 PAD 31 PAD 30 PAD 29 PAD 28 PAD 27 PAD 26

DCC

VSS

VSS

VSS

VSS

VIP

MIP

MIP

MIB

PAD 2

PAD 3

PAD 4

PAD 5

PAD 6

PAD 7

PAD 8

N/C

NDIN

DIN

DINT

CLOCKT

CLOCK

NCLOCK

N/C

PAD 9

PAD 10

PAD 11

PAD 12 PAD 13 PAD 14 PAD 15 PAD 16 PAD 17

SEL

GND

GND

GND

GND

GND

GND

NMARK

MARK

120

µm

120

150

µm

30

µm

1720

µm

1620

µm

1720

µm

1620

µm

50

µm

50

µm

Die Size:

1620µm x 1620µm

Actual Die Size: 1720µmx1720µm (after the die are cut up)

Pad Size:

120µm x 120µm

Pad Pitch:

150µm

Space

Between Pads:

30µm