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STCC5021 データシート(PDF) 34 Page - STMicroelectronics |
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STCC5021 データシート(HTML) 34 Page - STMicroelectronics |
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34 / 37 page ![]() Package information STCC5011, STCC5021 34/37 DocID024660 Rev 6 Figure 31. VFQFPN 16L - 3 x 3 x 0.8 mm with exposed pad 1.7 - recommended footprint Table 7. VFQFPN 16L - 3 x 3 x 0.8 mm with exposed pad 1.7 - package mechanical data(1), (2), (3), (4) Symbol Dimensions Notes Data book (mm) Nom. Min. Max. A 0.75 0.70 0.80 A1 0.02 0 0.05 A3 0.20 b 0.25 0.18 0.30 D 3 2.90 3.10 D2 1.70 1.50 1.80 E 3 2.90 3.10 E2 1.70 1.50 1.80 e 0.50 L 0.40 0.30 0.50 (5) 1. VFQFPN - standard for “thermally enhanced very thin fine pitch quad flat package no leads”. 2. The lead size is comprehensive of the thickness of the lead finishing material. 3. Dimensions do not include mold protrusion, not to exceed 0.15 mm. 4. Package outline exclusive of metal burr dimensions. 5. The value of “L” a JEDEC norm is min. 0.35 – max. 0.45. AM00951 |
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