Package information

M93C86-x M93C76-x M93C66-x M93C56-x M93C46-x

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DocID4997 Rev 17

11.3

UFDFN8 package information

Figure 16. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch

dual flat package outline

1.

Max. package warpage is 0.05 mm.

2.

Exposed copper is not systematic and can appear partially or totally according to the cross section.

3.

Drawing is not to scale.

4.

(not connected) in the end application.