13

LT1818/LT1819

18189f

18189 SS

OUT

+IN

–IN

R1

C

(One Amplifier)

SCHE ATIC

SI PLIFIED

PACKAGE DESCRIPTIO

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)

MSOP (MS8) 0802

0.53

± 0.015

(.021

± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.077)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.13

± 0.076

(.005

± .003)

0.86

(.034)

REF

0.65

(.0256)

BSC

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

12

3

4

4.90

± 0.15

(1.93

± .006)

8

7 6 5

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

NOTE 4

0.52

(.206)

REF

5.23

(.206)

MIN

3.2 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42

± 0.04

(.0165

± .0015)

TYP

0.65

(.0256)

BSC