“freeXpansionDesign”isatrademarkofBourns,Inc.

Specificationsaresubjecttochangewithoutnotice.

Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdeviceperformancemayvaryovertime.

Usersshouldverifyactualdeviceperformanceintheirspecificapplications.

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time(seconds)

Solder Reflow Recommendations

Notes:

• MF-NSMF models cannot be wave soldered. Please contact Bourns for

hand soldering recommendations.

• If reflow temperatures exceed the recommended profile, devices may not

meet the performance requirements.

• Compatible with Pb and Pb-free solder reflow profiles.

• Excess solder may cause a short circuit, especially during hand soldering.

guidelines.

MF-NSMF SERIES, REV. U, 06/17