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MPC7457 データシート(PDF) 41 Page - Freescale Semiconductor, Inc |
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MPC7457 データシート(HTML) 41 Page - Freescale Semiconductor, Inc |
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41 / 68 page  MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5 Freescale Semiconductor 41 Package Description 8 Package Description The following sections provide the package parameters and mechanical dimensions for the CBGA package. 8.1 Package Parameters for the MPC7447, 360 CBGA The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead ceramic ball grid array (CBGA). Package outline 25 × 25 mm Interconnects 360 (19 × 19 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height 2.72 mm Maximum module height 3.24 mm Ball diameter 0.89 mm (35 mil) 8.2 Mechanical Dimensions for the MPC7447, 360 CBGA Figure 20 provides the mechanical dimensions and bottom surface nomenclature for the MPC7447, 360 CBGA package. |
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