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ABB2513 データシート(PDF) 7 Page - Advanced Semiconductor Business Inc.

部品番号 ABB2513
部品情報  50 ~ 1200 MHz CATV Push-Pull Amplifier MMIC
PDF  8 Pages
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メーカー  ASB [Advanced Semiconductor Business Inc.]
ホームページ  http://www.asb.co.kr
Logo ASB - Advanced Semiconductor Business Inc.

ABB2513 データシート(HTML) 7 Page - Advanced Semiconductor Business Inc.

  ABB2513 Datasheet HTML 1Page - Advanced Semiconductor Business Inc. ABB2513 Datasheet HTML 2Page - Advanced Semiconductor Business Inc. ABB2513 Datasheet HTML 3Page - Advanced Semiconductor Business Inc. ABB2513 Datasheet HTML 4Page - Advanced Semiconductor Business Inc. ABB2513 Datasheet HTML 5Page - Advanced Semiconductor Business Inc. ABB2513 Datasheet HTML 6Page - Advanced Semiconductor Business Inc. ABB2513 Datasheet HTML 7Page - Advanced Semiconductor Business Inc. ABB2513 Datasheet HTML 8Page - Advanced Semiconductor Business Inc.  
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ASB Inc.
 sales@asb.co.kr
August 2017
ABB2513
4. Package Outline (SOIC8)
\
5. Surface Mount Recommendation (In mm)
Symbols
Dimensions (In mm)
MIN
NOM
MAX
A
1.40
1.50
1.60
A1
0.00
---
0.10
A2
---
1.45
---
B
0.33
---
0.51
C
0.19
---
0.25
D
4.80
---
5.00
D2
3.20
3.30
3.40
E
5.80
6.00
6.20
E1
3.80
3.90
4.00
E2
2.30
2.40
2.50
e
---
1.27
---
L
0.40
---
1.27
y
---
---
0.10
0
---
8
L1-L1
---
---
0.12
L1
1.04REF
NOTE
1. Add as much copper as possible to inner and
outer layers near the part to ensure optimal
thermal performance.
2. To ensure reliable operation, device ground
paddle-to-ground pad soldering is critical.
3. Add mounting screws near the part to fasten the
board to a heat sinker. Ensure that the ground &
thermal via region contacts the heat sinker.
4. A proper heat dissipation path underneath the
area of the PCB for the mounted device is strictly
required for proper thermal operation. Damage to
the device can result from inappropriate heat
dissipation.
le is RF and DC ground.
Part No.



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