ASL920 datasheet(17/18 Pages) ASB

17 / 18 page

17/18

ASB Inc.

 sales@asb.co.kr

March 2017

ASL920

8. Package Outline (TSSOP24)

9. Surface Mount Recommendation (In mm)

Symbols

Dimensions (In mm)

MIN

NOM

MAX

---

1.15

0.00

----

0.10

0.80

1.00

1.05

0.19

---

0.30

0.09

---

0.20

7.70

7.80

7.90

4.086

4.286

4.486

6.20

6.40

6.60

4.30

4.40

4.50

2.55

2.75

2.95

---

0.65

---

0.45

0.60

0.75

---

0.10





---



L1-L1

---

0.12

1.00REF

Lot No.

Part No.

0.76

2.20

0.34

1.55

3.42

NOTE

1. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

2. To ensure reliable operation, device ground

paddle-to-ground pad soldering is critical.

Recommended is that thermal grease used for

better thermal performance.

3. Add mounting screws near the part to fasten the

board to a heat sinker. Ensure that the ground &

thermal via region contacts the heat sinker.

4. A proper heat dissipation path underneath the area

of the PCB for the mounted device is strictly

required for proper thermal operation. Damage to

the device can result from inappropriate heat

dissipation.

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