ADT7320UCPZ-R2 datasheet(6/25 Pages) AD

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Data Sheet

ADT7320

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VDD to GND

−0.3 V to +7 V

DIN Input Voltage to GND

−0.3 V to VDD + 0.3 V

DOUT Voltage to GND

−0.3 V to VDD + 0.3 V

SCLK Input Voltage to GND

−0.3 V to VDD + 0.3 V

CS Input Voltage to GND

−0.3 V to VDD + 0.3 V

CT and INT Output Voltage to GND

−0.3 V to VDD + 0.3 V

ESD Rating (Human Body Model)

2.0 kV

Operating Temperature Range1

−40°C to +150°C

Storage Temperature Range

−65°C to +160°C

Maximum Junction Temperature, TJMAX

150°C

Power Dissipation2

16-Lead LFCSP3

WMAX = (TJMAX − TA)/θJA

Thermal Impedance4

θJA, Junction-to-Ambient (Still Air)

37°C/W

θJC, Junction-to-Case

33°C/W

IR Reflow Soldering

220°C

Peak Temperature (RoHS-Compliant

Package)

260°C (0°C/−5°C)

Time at Peak Temperature

20 sec to 40 sec

Ramp-Up Rate

3°C/sec maximum

Ramp-Down Rate

−6°C/sec maximum

Time from 25°C to Peak Temperature

8 minutes maximum

1 Sustained operation above 125°C results in a shorter product lifetime. For

more information, contact an Analog Devices, Inc., sales representative.

2 Values relate to package being used on a standard 2-layer PCB. This gives a

worst-case θJA and θJC.

3 TA = ambient temperature.

4 Junction-to-case resistance is applicable to components featuring a

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient resistance is more useful for air cooled, PCB-

mounted components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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