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ショートカット   GT25-28DP-2.2H(1) の検索結果.
一致 , 類似  GT25-28DP-2.2H(1)
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後一致   No Data
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GT25-28DP-2.2H データシート, PDF

品番検索 : 一致 , 類似&前一致 "GT25-28DP-2.2H" - 結果は : 1 ( 1/1 Page)
メーカー部品番号データシート部品情報
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Hirose Electric		 GT25-28DP-2.2H HIROSE-GT25-28DP-2.2H Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.

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GT25-28DP-2.2H Datasheet ,PDF

Search Partnumber : Start with "GT25-28DP-2.2H" - Total : 55 ( 1/3 Page)
メーカー部品番号データシート部品情報
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Hirose Electric		 GT25-24DP-2.2H HIROSE-GT25-24DP-2.2H Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-24DP-2.2V HIROSE-GT25-24DP-2.2V Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-24DS-HU/R HIROSE-GT25-24DS-HU/R Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-12DP-2.2H HIROSE-GT25-12DP-2.2H Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-12DS-HU/R HIROSE-GT25-12DS-HU/R Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-16DP-2.2H HIROSE-GT25-16DP-2.2H Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-16DP-2.2V HIROSE-GT25-16DP-2.2V Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-32DP-2.2H HIROSE-GT25-32DP-2.2H Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-32DP-2.2V HIROSE-GT25-32DP-2.2V Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-32DS-HU/R HIROSE-GT25-32DS-HU/R Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-40DP-2.2H HIROSE-GT25-40DP-2.2H Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-40DP-2.2V HIROSE-GT25-40DP-2.2V Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-8DP-2.2H HIROSE-GT25-8DP-2.2H Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-8DS-HU/R HIROSE-GT25-8DS-HU/R Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
GT25-8P-2.2H HIROSE-GT25-8P-2.2H Datasheet
246Kb/5P		 Metal holddowns to solder by reflow are used instead of screws for PCB mounting.
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Goford Semiconductor		 GT250P10M GOFORD-GT250P10M Datasheet
906Kb/6P		 P-Channel Enhancement Mode Power MOSFET
GT250P10T GOFORD-GT250P10T Datasheet
938Kb/6P		 P-Channel Enhancement Mode Power MOSFET
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GTM CORPORATION		 GT2530 GTM-GT2530 Datasheet
390Kb/7P		 N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET
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E-Tech Electronics LTD		 GT2530 ETL-GT2530 Datasheet
395Kb/7P		 N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET
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GTM CORPORATION		 GT2531 GTM-GT2531 Datasheet
389Kb/7P		 N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET

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