SN65MLVD047

SLLS606 − MARCH 2004

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2

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

PART NUMBER

PACKAGE MARKING

PACKAGE/CARRIER

SN65MLVD047D

MLVD047

16-Pin SOIC/Tube

SN65MLVD047DR

MLVD047

16-Pin SOIC/Tape and Reel

SN65MLVD047PW

MLVD047

16-Pin TSSOP/Tube

SN65MLVD047PWR

MLVD047

16-Pin TSSOP/Tape and Reel

PACKAGE DISSIPATION RATINGS

PACKAGE

PCB JEDEC

STANDARD

TA ≤ 25°C

POWER RATING

DERATING FACTOR

ABOVE TA = 25°C(1)

TA = 85°C

POWER RATING

D(16)

Low-K(2)

898 mW

7.81 mW/

_C

429 mW

PW(16)

Low-K(2)

592 mW

5.15 mW/

_C

283 mw

PW(16)

High-K(3)

945 mW

8.22 mW/

_C

452 mw

(1) This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow.

(2) In accordance with the Low-K thermal metric difinitions of EIA/JESD51−3.

(3) In accordance with the High-K thermal metric difinitions of EIA/JESD51−7.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNITS

Supply voltage range(2), VCC

−0.5 V to 4 V

Input voltage range, VI

A, EN, EN

−0.5 V to 4 V

Output voltage range, VO Y, Z

−1.8 V to 4 V

Human Body Model(3)

Y and Z

±9 kV

Electrostatic discharge

Human Body Model(3)

All pins

±4 kV

Electrostatic discharge

Charged-Device Model(4)

All pins

±1500 V

Machine Model(5)

All pins

200 V

Junction temperature, TJ

140

°C

Continuous power dissipation, PD

See Dissipation Rating Table

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values, except differential I/O bus voltages, are with respect to the circuit ground terminal.

(3) Tested in accordance with JEDEC Standard 22, Test Method A114−B.

(4) Tested in accordance with JEDEC Standard 22, Test Method C101−A.

(5) Tested in accordance with JEDEC Standard 22, Test Method A115−A.