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MPC941 データシート(PDF) 11 Page - Integrated Device Technology

部品番号 MPC941
部品情報  Low Voltage, 1:27 Clock Distribution Chip
PDF  13 Pages
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メーカー  IDT [Integrated Device Technology]
ホームページ  http://www.idt.com
Logo IDT - Integrated Device Technology

MPC941 データシート(HTML) 11 Page - Integrated Device Technology

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REVISION 10 3/18/15
11
LOW VOLTAGE, 1:27 CLOCK DISTRIBUTION CHIP
MPC941 DATA SHEET
PACKAGE DIMENSIONS
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5m, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLAN AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUMS T, U, AND Z TO BE DETERMINED AT
DATAUM PLANE AB.
DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
A
A1
Z
0.200 AB T-U
4X
Z
0.200 AC T-U
4X
B
B1
1
12
13
24
25
36
37
48
S1
S
V
V1
DETAIL Y
9
T
U
Z
P
AE
AE
T, U, Z
DETAIL Y
M˚
TOP & BOTTOM
L˚
W
K
AA
E
C
H
R
DETAIL AD
AD
G
0.080 AC
AB
AC
BASE METAL
N
J
F
D
T-U
M
0.080
Z
AC
SECTION AE-AE
MIN
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0˚
0.150
MAX
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
7˚
0.250
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
L
R
S
S1
V
V1
W
AA
MILLIMETERS
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
12˚ REF
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
CASE 932-03
ISSUE F
48-LEAD LQFP PACKAGE



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