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VL53L1 データシート(PDF) 29 Page - STMicroelectronics |
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VL53L1 データシート(HTML) 29 Page - STMicroelectronics |
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29 / 35 page  DocID031281 Rev 3 29/35 VL53L1X Packaging and labeling 35 8 Packaging and labeling 8.1 Product marking A 2-line product marking is applied on the backside of the module (i.e. on the substrate). The first line is the silicon product code, and the second line, the internal tracking code. Figure 22. Example of prototype marking 8.2 Inner box labeling The labeling follows the ST standard packing acceptance specification. The following information will be on the inner box label: • Assembly site • Sales type • Quantity • Trace code • Marking • Bulk ID number 8.3 Packing At customer/subcontractor level, it is recommended to mount the VL53L1X in a clean environment to avoid foreign material deposition. To help avoid any foreign material contamination at phone assembly level the modules are shipped in a tape and reel format with a protective liner. The packaging is vacuum-sealed and includes a desiccant. The liner is compliant with reflow at 260 °C. It must be removed during assembly of the customer device, just before mounting the cover glass. |
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