GPR25L011E datasheet(2/38 Pages) GENERALPLUS

2 / 38 page

GPR25L011E

Proprietary & Confidential

Aug. 09, 2011

Version: 1.0

Table of Contents

PAGE

1. FEATURES.................................................................................................................................................................................................. 4

1.1. GENERAL .............................................................................................................................................................................................. 4

1.2. PERFORMANCE...................................................................................................................................................................................... 4

1.3. SOFTWARE FEATURES ........................................................................................................................................................................... 4

1.4. HARDWARE FEATURES .......................................................................................................................................................................... 4

2. GENERAL DESCRIPTION .......................................................................................................................................................................... 5

3. PIN CONFIGURATIONS ............................................................................................................................................................................. 5

3.1. 8-PIN SOP (150MIL) ............................................................................................................................................................................. 5

4. PIN DESCRIPTION...................................................................................................................................................................................... 5

5. BLOCK DIAGRAM ...................................................................................................................................................................................... 6

6. DATA PROTECTION................................................................................................................................................................................... 7

7. HOLD FEATURE ......................................................................................................................................................................................... 8

8. DEVICE OPERATION ............................................................................................................................................................................... 11

9. COMMAND DESCRIPTION ...................................................................................................................................................................... 12

9.1. WRITE ENABLE (WREN)...................................................................................................................................................................... 12

9.2. WRITE DISABLE (WRDI) ...................................................................................................................................................................... 12

9.3. READ IDENTIFICATION (RDID) .............................................................................................................................................................. 12

9.4. READ STATUS REGISTER (RDSR)........................................................................................................................................................ 12

9.5. WRITE STATUS REGISTER (WRSR)...................................................................................................................................................... 13

9.6. READ DATA BYTES (READ) ................................................................................................................................................................. 14

9.7. READ DATA BYTES AT HIGHER SPEED (FAST_READ) ......................................................................................................................... 14

9.8. DUAL OUTPUT MODE (DREAD) ........................................................................................................................................................... 14

9.9. SECTOR ERASE (SE) ........................................................................................................................................................................... 14

9.10.BLOCK ERASE (BE) ............................................................................................................................................................................. 14

9.11.CHIP ERASE (CE) ................................................................................................................................................................................ 14

9.12.PAGE PROGRAM (PP).......................................................................................................................................................................... 15

9.13.DEEP POWER-DOWN (DP) ................................................................................................................................................................... 15

9.14.RELEASE FROM DEEP POWER-DOWN (RDP), READ ELECTRONIC SIGNATURE (RES) ............................................................................. 15

9.15.READ ELECTRONIC MANUFACTURER ID & DEVICE ID (REMS) .............................................................................................................. 16

10. POWER-ON STATE .................................................................................................................................................................................. 17

11. ELECTRICAL SPECIFICATIONS ............................................................................................................................................................. 18

11.1.ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................................. 18

11.2.CAPACITANCE TA = 25℃, F = 1.0 MHZ ................................................................................................................................................ 18

11.3.DC CHARACTERISTICS (TEMPERATURE = -40℃ TO 85℃ FOR INDUSTRIAL GRADE, VCC = 2.7V ~ 3.6V)(TABLE5) ................................. 20

11.4.AC CHARACTERISTICS (TEMPERATURE = -40℃ TO 85℃ FOR INDUSTRIAL GRADE, VCC = 2.7V ~ 3.6V)(TABLE6).................................. 21

11.5.POWER-UP(TABLE7)............................................................................................................................................................................ 22

11.6.INITIAL DELIVERY STATE ...................................................................................................................................................................... 22

12. RECOMMENDED OPERATING CONDITIONS......................................................................................................................................... 32

12.1.AT DEVICE POWER-UP ........................................................................................................................................................................ 32

13. ERASE AND PROGRAMMING PERFORMANCE .................................................................................................................................... 33

14. DATA RETENTION ................................................................................................................................................................................... 33

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