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EMC1812 データシート(PDF) 13 Page - Microchip Technology |
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EMC1812 データシート(HTML) 13 Page - Microchip Technology |
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13 / 102 page  • DN2/DP3: DN2 cathode and DP3 anode 3.12 Anti-Parallel Diode Pair (DP1/DN2 and DN1/DP2) • DP1/DN2: DP1 anode and DN2 cathode • DN1/DP2: DN1 cathode and DP2 anode 3.13 Anti-Parallel Diode Pair (DP3/DN4 and DN3/DP4) • DP3/DN4: DP3 anode and DN4 cathode • DN3/DP4: DN3 cathode and DP4 anode 3.14 SMBus Clock (SCL) This is the SMBus/I2C input clock pin for SMBus communication. 3.15 Exposed Thermal Pad (EP) There is no internal connection between the Exposed Thermal Pad (EP) and the GND pin. They must be connected to the same electric potential on the Printed Circuit Board (PCB). Grounding is recommended for mechanical support. Multi-Channel Low-Voltage Remote Di... Pin Descriptions © 2018 Microchip Technology Inc. Datasheet DS20005751A-page 13 |
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