HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HT200207

Issued Date : 2002.04.01

Revised Date : 2004.10.01

Page No. : 3/4

HT117

HSMC Product Specification

TO-126 Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

A

B

C

F

D

E

H

12 3

K

J

I

a1

a1

L

M

a1

a1

G

3-Lead TO-126

Plastic Package

HSMC Package Code: T

Marking:

Control Code

Date Code

HT

11 7

Pb Free Mark

Pb-Free: "

Normal: None

Note: Green label is used for pb-free packing

Pin Style: 1.Emitter 2.Collector 3.Base

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

DIM

Min.

Max.

A

3.81

3.91

B

6.99

7.09

C

13.50

15.50

D

7.52

7.72

E

0.95

1.05

F

0.71

0.81

G

1.22

1.32

H

4.34

4.80

I

2.41

2.66

J

1.14

1.39

K

1.14

1.39

L-

*0.55

M

3.50

3.86

a1

-

*3

°

*: Typical, Unit: mm