ADL6012ACPZN-R2 datasheet(6/24 Pages) AD

6 / 24 page

ADL6012

Data Sheet

Rev. 0 | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (VPOS to OCOM, RFCM)

5.5 V

RFIN Input Signal Power1

Average

20 dBm

Peak

23 dBm

DC Voltage at RFIN, VOCM, ENBL

−0.3 V to VPOS + 0.3 V

Case Operating Temperature Range

ADL6012ACPZN

−40°C to +105°C

ADL6012SCPZN

−55°C to +125°C

Junction Temperature (TJ)

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

Guaranteed by design. Not production tested.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the junction to ambient thermal impedance, and θJC is the

junction to case (exposed pad) thermal impedance.

Table 3. Thermal Resistance

Package Type1

θJA

θJC2

Unit

CP-10-12

74.69

11.64

°C/W

Thermal impedance simulated value is based on no airflow with the exposed

pad soldered to a 4-layer JEDEC board.

θJC is the thermal impedance from junction to the exposed pad on the

underside of the package.

ESD CAUTION

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