Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.

Please note that the contents may change without any prior notice due to reasons such as upgrading.

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notch-filter_commercial_avrf_en.fm

EMC Components

AVRF series

Attention after implementation

Cleaning

(1) If cleaning liquid is inappropriate, residues and other foreign

body of fluxes builds up on products, and can degrade the perfor-

mance of products (particularly the insulation resistance).

(2) Wash conditions may compromise performance of products if

they are improper (wash due, wash excess).

2-1) For wash due

(a) By substance of a system in flux residue halide, metal including

terminal electrodes may experience corrosion.

(b) Substance of a system in flux residue halide builds up on prod-

ucts, and reduces the insulation resistance.

(c) Soluble flux makes comparisons of colophony series flux, and

there is event with trends of significant (1) and(2).

2-2) For excess wash

(1) Owing to lavage, products deteriorates, and reduces perfor-

mance of products.

(2) In ultrasonography, when output is passed, substrate resonates

size, and crack occurs in body and sprang of products in vibra-

tion of substrate. Since this may reduce the strength of the termi-

nal electrode, please note the following conditions. [Please review

the italicized portion, as I am unsure what you mean to convey

here.]

Ultrasound output

Ultrasonic frequency

Ultrasound cleaning time

2-3) Concentration including halogen that when cleaning liquid to

pollution, when you released is higher, and may cause similar of

results into wash due.

Substrate handling after component mounting

(1) When substrate is divided, a flexible so that show in following dia-

gram to substrate, and is given by stress including twist, as there is

possibility that crack occurs of products, please check that stress is

within acceptable limits.

(2) During each substrate operational check, push pressure with

contact failure of check pin of boards checkers of check pin may be

toned up to be prevented. As substrate is bent under loading, prod-

ucts is broken owing to stress. There is also the possibility that sol-

der on the terminal electrode will peel off. Follow the diagram for

reference, and check that the substrate bends, please.

Single-part component handling

To drop impact, as there is possibility that breakage and crack is

entered, do not products that(1) products falls.

(2) At stacking storage after implementation and treatment of sub-

strate, corner of boards is regarded as products. Please be careful,

as there is the possibility that breakage and cracks will occur on

impact.

Bends

Twist

Item

Cases to avoid

Recommended case

Substrate sags

Peeling

Check pin

Check pin

Support pin

Floor

Crack

Board

Crack