ADMV1011AEZ-R7 datasheet(5/26 Pages) AD

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Data Sheet

ADMV1011

Rev. A | Page 5 of 26

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

VDLO

5.5 V

VDRF1 − VGRF1, VDRF2 − VGRF21

8 V

VGRF1, VGRF2

0 V

VCTRL2, VCTRL3

−6 V to +0.5 V

IF1/IF2 Source and Sink Current

2 mA

Maximum Junction Temperature (TJ)

175°C

Maximum Power Dissipation

2.64 W

Lifetime Maximum Junction Temperature (TJ)

>1 million hours

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Input Power

15 dBm

Lead Temperature (Soldering 60 sec)

260°C

Moisture Sensitivity Level (MSL)3

MSL3

Electrostatic Discharge (ESD) Sensitivity

Field Induced Charge Device Model

(FICDM)

500 V

Human Body Model (HBM)

250 V

The maximum VDRF voltage and the minimum VGRF voltage is determined

by this difference. If a maximum VDRF voltage of +5.5 V is required, then the

minimum VGRF voltage is −2.5 V.

To calculate power dissipation, which is a theoretical number, use the

following equation: (TJ − 85°C)/θJC.

Based on IPC/JEDEC J-STD-20 MSL classifications.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is thermal resistance, junction to ambient (°C/W), and θJC is

thermal resistance, junction to case (°C/W).

Table 5.

Package Type

θJA1

θJC

Unit

E-32-1

33.4

°C/W

See JEDEC standard JESD51-2 for additional information on optimizing the

thermal impedance (printed circuit board (PCB) with 3 × 3 vias).

ESD CAUTION

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