MCP6476 datasheet(39/46 Pages) MICROCHIP

39 / 46 page

 2020-2021 Microchip Technology Inc.

DS20006419B-page 39

MCP6476/6R/6U/7/9

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

DETAIL B

(L1)

( 3)

( 2)

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

0.65 BSC

1.00

0.45

0.19

–

0.05

–

0.60

–

MILLIMETERS

MIN

NOM

0.75

0.30

1.20

0.15

MAX

1.00 REF

Footprint

Overall Length

5.00

Terminal Thickness

0.09–0.20

–

0.09

–

Lead Bend Radius

–

0.09

–

Lead Bend Radius

–

0°

8°

Foot Angle

12° REF

Mold Draft Angle

0.80

1.05

12° REF

Mold Draft Angle

6.40 BSC

4.40

–

4.30

4.50

4.90

5.10

14 Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]

Microchip Technology Drawing C04-087 Rev D

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