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HMC8193LC4TR-R5 データシート(PDF) 36 Page - Analog Devices |
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HMC8193LC4TR-R5 データシート(HTML) 36 Page - Analog Devices |
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36 / 36 page ![]() HMC8193 Data Sheet Rev. B | Page 36 of 36 OUTLINE DIMENSIONS 12 0.50 BSC 2.50 REF BOTTOM VIEW TOP VIEW 1 24 7 13 18 19 6 0.36 0.30 0.24 EXPOSED PAD PIN 1 INDICATOR 4.05 3.90 SQ 3.75 3.10 BSC FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 2.60 2.50 SQ 2.40 PIN 1 0.32 BSC 0.08 BSC SIDE VIEW 1.00 0.90 0.80 SEATING PLANE Figure 122. 24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Body Material Lead Finish Package Description MSL Rating2 Package Option HMC8193LC4 −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal LCC MSL3 E-24-1 HMC8193LC4TR −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal LCC MSL3 E-24-1 HMC8193LC4TR-R5 −40°C to +85°C Alumina Ceramic Gold over Nickel 24-Terminal LCC MSL3 E-24-1 EV1HMC8193LC4 Evaluation PCB Assembly 1 The HMC8193LC4, the HMC8193LC4TR, and the HMC8193LC4TR-R5 are RoHS compliant parts. 2 See the Absolute Maximum Ratings section. ©2017–2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14353-0-5/18(B) |
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