MPC5121EE datasheet(21/86 Pages) NXP

21 / 86 page

Electrical and Thermal Characteristics

MPC5121e (Early) Data Sheet, Rev. 1

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

2.1.5

Power Dissipation

Power dissipation of the MPC5121e is caused by 4 different components: the dissipation of the internal or core digital logic

(supplied by VDD_CORE), the dissipation of the analog circuitry (supplied by SYS_PLL_AVDD and CORE_PLL_AVDD),

the dissipation of the IO logic (supplied by VDD_MEM_IO and VDD_IO) and the dissipation of the PHYs (supplied by own

supplies). Table 7 details typical measured core and analog power dissipation figures for a range of operating modes. However,

the dissipation due to the switching of the IO pins can not be given in general, but must be calculated for each application case

using the following formula:

Eqn. 1

where N is the number of output pins switching in a group M, C is the capacitance per pin, VDD_IO is the IO voltage swing, f

is the switching frequency and PIOint is the power consumed by the unloaded IO stage. The total power consumption of the

MPC5121e processor must not exceed the value, which would cause the maximum junction temperature to be exceeded.

Eqn. 2

2.1.6

Thermal Characteristics

Table 7. Power Dissipation

Core Power Supply (VDD_CORE)

SpecID

Mode

High-Performance

Unit

e300 = 300 MHz, CSB = 200 MHz

Operational1,

1 Typical core power is measured at VDD_CORE = 1.4 V, Tj = 25 C.

800

D5.1

Deep-Sleep1,

1mW

D5.2

Hibernation

D5.3

PLL/OSC Power Supplies (SYS_PLL_AVDD, CORE_PLL_AVDD)

Typical

D5.4

Unloaded I/O Power Supplies (VDD_IO, VDD_MEM_IO)

Typical

300

D5.5

PHY Power Supplies (USB_VDDA, SATA_VDDA)

Typical

200

D5.6

Table 8. Thermal Resistance Data

Rating

Board Layers

Sym

Value

Unit

SpecID

Junction to Ambient Natural

Convection1,2

Single layer board (1s)

RθJA

°C/W

D6.1

Junction to Ambient Natural

Convection1,3

Four layer board (2s2p)

RθJMA

°C/W

D6.2

IOint

∑

CVDD_IO

total

core

analog

PPHYs

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