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STM32G0 データシート(PDF) 108 Page - STMicroelectronics

部品番号 STM32G0
部品情報  Arm® Cortex®-M0 32-bit MCU, up to 128 KB Flash, 36 KB RAM, 4x USART, timers, ADC, DAC, comm. I/Fs, 1.7-3.6V
PDF  135 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G0 データシート(HTML) 108 Page - STMicroelectronics

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Package information
STM32G071x8/xB
108/135
DS12232 Rev 4
6
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
6.1
WLCSP25 package information
WLCSP25 is a 25-ball, 2.30 x 2.48 mm wafer-level chip-scale package with 0.4 mm pitch.
Figure 32. WLCSP25 chip-scale package outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
A06J_WLCSP25_ME_V1
Z
A
B
C
D
E
21
3
4
5
G
e
e
e2
e1
F
A1 ball location
D
E
aaa
(4X)
BOTTOM VIEW
TOP VIEW
A
A2
A1
bbb Z
DETAIL A
A3
A2
b
FRONT VIEW
SIDE VIEW
DETAIL A
ROTATED 90
BUMP
eee Z
b (25x)
ccc
Z
Y
X
ddd
Z
M
M
A1



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