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STM8S103F2 データシート(PDF) 96 Page - STMicroelectronics |
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STM8S103F2 データシート(HTML) 96 Page - STMicroelectronics |
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96 / 121 page  Package information STM8S103F2 STM8S103F3 STM8S103K3 96/121 DocID15441 Rev 14 Section 11.7: UFQFPN recommended footprint shows the recommended footprints for UFQFPN with and without on-board emulation. Figure 52. UFQFPN20 - 20-lead, 3x3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package recommended footprint 1. Dimensions are expressed in millimeters. Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. L3 - 0.375 - - 0.0148 - L4 - 0.200 - - 0.0079 - L5 - 0.150 - - 0.0059 - b 0.180 0.250 0.300 0.0071 0.0098 0.0118 e - 0.500 - - 0.0197 - ddd - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits Table 54. UFQFPN20 - 20-lead, 3x3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package mechanical data (continued) Dim. mm inches(1) Min Typ Max Min Typ Max |
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