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STM32G030F6 データシート(PDF) 83 Page - STMicroelectronics |
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STM32G030F6 データシート(HTML) 83 Page - STMicroelectronics |
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83 / 94 page ![]() DS12991 Rev 4 83/94 STM32G030x6/x8 Package information 90 6.2 TSSOP20 package information TSSOP20 is a 20-lead, 6.5 x 4.4 mm thin small-outline package with 0.65 mm pitch. Figure 30. TSSOP20 package outline 1. Drawing is not to scale. Table 68. TSSOP20 package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Min. Typ. Max. Min. Typ. Max. A - - 1.200 - - 0.0472 A1 0.050 - 0.150 0.0020 - 0.0059 A2 0.800 1.000 1.050 0.0315 0.0394 0.0413 b 0.190 - 0.300 0.0075 - 0.0118 c 0.090 - 0.200 0.0035 - 0.0079 D(2) 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 6.400 6.500 6.600 0.2520 0.2559 0.2598 E 6.200 6.400 6.600 0.2441 0.2520 0.2598 E1(3) 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 4.300 4.400 4.500 0.1693 0.1732 0.1772 e - 0.650 - - 0.0256 - L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 YA_ME_V3 1 20 C c L E E1 D A2 A k e b 10 11 A1 L1 aaa SEATING PLANE C GAUGE PLANE 0.25 mm PIN 1 IDENTIFICATION |
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