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Revision 1.19

13 - 15

AS1150, AS1151

Data Sheet

Board Layout

10 Package Drawings and Markings

Figure 22. 16-Pin TSSOP Package

Notes:

1. All dimensions are in millimeters; angles in degrees.

2. Dimensions and tolerancing per ASME Y14.5M-1994.

3. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15mm per side.

4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm

per side.

5. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of

dimension b at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum

space between protrusion and adjacent lead is 0.07mm for 0.5mm pitch packages.

6. Terminal numbers shown are for reference only.

7. Datums A and B to be determined at datum plane H.

8. Dimensions D and E1 to be determined at datum plane H.

9. This dimension applies only to variations with an even number of leads per side. For variations with an odd number

of leads per package, the center lead must be coincident with the package centerline, datum A.

10. Cross section A-A to be determined at 0.10 to 0.25mm from the leadtip.

Symbol

0.65mm Lead Pitch

1, 2

Note

Symbol

0.65mm Lead Pitch

1, 2

Note

Min

Nom

Max

Min

Nom

Max

A-

-

1.10

θ10º

-

8º

A1

0.05

-

0.15

L1

1.0 Ref

A2

0.85

0.90

0.95

aaa

0.10

L

0.50

0.60

0.75

bbb

0.10

R0.09

-

-

ccc

0.05

R1

0.09

-

-

ddd

0.20

b

0.19

-

0.30

5

e

0.65 BSC

b1

0.19

0.22

0.25

θ212º Ref

c

0.09

-

0.20

θ312º Ref

c1

0.09

-

0.16

Variations

D

4.90

5.00

5.10

3, 8

e

0.65 BSC

E1

4.30

4.40

4.50

4, 8

N

16

6

E

6.4 BSC